lc0406fc3.3c thru lc0406fc24c 1 05158.r3 8/03 www .protekde vices.com low capacitance flip chip arra y only one name means protektion? applica tions ? cellular phones ? personal digital assistant (pda) ? notebook computers ? smart cards iec compa tibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns fea tures ? esd protection > 25 kilovolts ? available in six voltage types ranging from 3.3v to 24v ? 200 watts peak pulse power per line (tp = 8/20s) ? low clamping voltage ? bidirectional configuration & monolithic structure ? protects 3 to 5 lines ? low capacitance ? low leakage current mechanical characteristics ? standard eia chip size: 0406 ? weight 0.73 milligrams (approximate) ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? device marking on reel ? top contacts: solder bump 0.004? in height (nominal) 0406 (single chip shown) 05158 pin configura tion
2 www .protekde vices.com 05158.r3 8/03 lc0406fc3.3c thru lc0406fc24c device characteristics maximum ratings @ 25c unless otherwise specified operating temperature symbol value -55 c to 150 cc c -55 c to 150 c units t j t stg parameter storage temperature peak pulse power (t p = 8/20s) - see figure 1 p pp 200 watts 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 figure 2 pulse wave form 0.01 1 10 100 1,000 10,000 t d - pulse duration - s 10 100 1,000 10,000 p pp - peak pulse current - watts figure 1 peak pulse power vs pulse time 200w, 8/20s waveform electrical characteristics per line @ 25c unless otherwise specified pa rt number (see note 1) minimum breakdown voltage @ 1ma v (br) volts maximum clamping voltage (see fig. 2) @ i p = 1a v c volts maximum clamping voltage (see fig. 2) @8/20s v c @ i pp typical capacitance @0v, 1 mhz c pf lc0406fc3.3c LC0406FC05C lc0406fc08c lc0406fc12c lc0406fc15c lc0406fc24c 3.3 5.9 8.0 12.0 15.0 24.0 4.0 6.0 8.5 13.3 16.7 26.7 7.0 11.0 13.2 19.8 25.4 37.2 12.5v @ 16a 13v @ 15a 18v @ 11a 26.9v @ 7.4a 34.5v @ 5.8a 50.6v @ 4a 70 35 32 30 25 20 maximum leakage current (see note 2) @v wm i d a 75* 10** 1 1 1 1 rated stand-off voltage v wm volts note 1: all devices are bidirectional. electrical characteristics apply in both directions. note 2: *maximum leakage current < 5a @ 2.8v. **maximum leakage current <500na @ 3.3v.
3 www .protekde vices.com 05158.r3 8/03 lc0406fc3.3c thru lc0406fc24c graphs 0 5 10 15 20 v c - clamping voltage - volts 0 4 8 12 14 figure 6 typical clamping voltage vs peak pulse current for LC0406FC05C 10 6 2 i pp - peak pulse current - amps 225c 5-10 sec instantaneous to 200c soldering time cool down time 1-2 minutes to 150c 1-2 minutes to 25c pre-heat time 100c 200c note: this reflow profile does not take into account the printed circuit board (pcb) material heating time. additional time may be required for the preheat time and cool down time upon the pcb or board material. 0 25 50 75 100 125 150 t l - lead temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0 figure 4 reflow solder profile esd test pulse - 25 kilovolt, 1/30ns (waveshape) figure 5 overshoot & clamping voltage for LC0406FC05C 5 volts per division -5 5 15 25 35
4 www .protekde vices.com 05158.r3 8/03 lc0406fc3.3c thru lc0406fc24c package outline & dimensions a b c e f g h i 0.56 nom 0.86 nom 0.99 0.0254 0.15 sq 1.5 0.0254 0.15 nom 0.127 max 0.076 min 0.406 nom 0.022 nom 0.034 nom 0.039 0.001 0.006 sq 0.059 0.001 0.006 nom 0.005 max 0.003 min 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). package outline mounting pad la yout - option 1 a c d e f g h i 0.51 0.30 0.46 0.20 0.15 sq 0.71 0.99 0.51 note: 1. preferred: using 0.1mm (0.004 ? ) stencil. 0.020 0.012 0.018 0.008 0.006 sq 0.028 0.039 0.020 pad dimensions dim millimeters inches outline & dimensions: rev 3 - 11/02, 06023 g h e f i side a b c top end c solder print 0.010? - 0.012? dia. a h d i solder pads f g e solder mask die solder bumps
5 www .protekde vices.com 05158.r3 8/03 lc0406fc3.3c thru lc0406fc24c package outline & dimensions a f g h i 0.51 0.15 sq 0.71 0.99 0.51 0.020 0.006 sq 0.028 0.039 0.020 dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002 ? ). 3. preferred: using 0.1mm (0.004 ? ) stencil. mounting pad la yout - option 2 tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia 481. 2. 8mm plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-1 (i.e., LC0406FC05C-t75-1). 3. 8mm paper tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-2 (i.e., LC0406FC05C-t75-2). outline & dimensions: rev 3 - 11/02, 06023 copyright ? protek devices 2003 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer ? s and that in furnishing engineering and technical assistance, protek assumes no responsibility with respect to the selection or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www .protekde vices .com tape & reel orientation note: 1. top view of tape. solder bumps are face down in tape package. triple die - 0406 solder print 0.014? [0.36] dia. a h i f g solder mask die solder bumps copper contacts 0.009? [0.23] dia.
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